On November 8,2024, the company's "Semiconductor Test Equipment Intelligent Manufacturing and Innovation R & D Center Phase I project" Main building structure was capped in Tianjin Tiankai Huayuan Park.
On October 17,2023, the company's "Semiconductor Test Equipment Intelligent Manufacturing and Innovation R & D Center Phase I project" was founded in Tianjin Huayuan Science and Technology Park.
On March 3,2023, the company was successfully listed on the main board of the Shanghai Stock Exchange (Stock code: 603061).
This exhibition was held in Penang International Convention and Exhibition Center, Malaysia.
In this exhibition, we showed and communicated the operation mode and functional indicators of our products to customers and guests,
In this exhibition, we showed and communicated the operation mode and functional indicators of our products to all guests.
